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XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK DES 560B Precision Handheld Digital

SKU: 98384691748
4.7
USD25.89 USD70.89 Clinic rate

Pay in 4 interest-free payments of $6.47 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 16 - Sep 21

Chrome lens
Description

DES 560B Precision Handheld Digital Hot Air Gun De-Soldering Station

Read Pattern

Worldwide 100-240 volt AC input voltage

· Free ROTS Operating system

Cleaning kit:

XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK DES 560B Precision Handheld DigitalXZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8 A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. Features: Magnetic power positioning with strong magnetic force and automatic alignment. Built in powerful magnets with strong adsorption for easy pick up and fast maintenance. Easy to operate

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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