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HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Voltage:110V Rotating lens barrel design

SKU: 77748765179
4.8
USD26.99 USD71.99 Clinic rate

Pay in 4 interest-free payments of $6.75 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 24 - Sep 29

Chrome lens
Description

Rotating lens barrel design

1x Keyboard

dirt resistance and easy to clean

temperature is both adjustable and stable while deviations are minimized

8 cm (7") diameter and a resolution of 800 × 480 pixel without any problems

HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Voltage:110V Rotating lens barrel designHMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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