SIM8200-M2 SIMCom Original 5G Module rpi heat sink Technical Datasheet can be found

Technical Datasheet can be found here

Impedance: Maximum: 2

Standard ISP_6PIN connector

Operating temperature -20°-85°

3 Wire and 4 Wire SPI Communication

SIM8200-M2 SIMCom Original 5G Module rpi heat sink Technical Datasheet can be foundIM8200 M2 SIMCom Original 5G Module M. 2 Form Factor, High Throughput Data Communication The SIM8200 M2 series is the Multi Band 5G NR LTE FDD LTE TDD HSPA+ module which supports R15 5G NSA SA up to 2. 4Gbps data transfer. It has strong extension capability with rich interfaces including UART,PCIe,USB3. 1, GPIO etc. The module provides much flexibility and ease of integration for customer's application. The SIM8200 M2 series adopts M. 2 form factor,